AWA to host in-mold labeling and decoration conference

With the market for in-mold labeling and in-mold decoration growing, AWA Alexander Watson Associates is hosting AWA IMLCON & IMDCON 2015, an annual conference and exhibition. The topics will touch on innovation, new materials, application development and market potential.

The conference will take place on February 18-19 in Miami, FL.

“It is a one-of-a-kind event focused on the in-mold labeling and in-mold decorating market,” says Corey Reardon, president and CEO of AWA Alexander Watson Associates. “It attracts delegates and brand owners from around the world, and is a must-attend industry conference.”

The 2015 event’s two concurrent sessions dedicated specifically to IML and IMD will complement the general conference and tabletop exhibition.

Speakers will represent the entire value chain, from technology sectors such as diecutting, MuCell technology, thermoforming and TRIM.   The program also includes M&A and consolidation activity within the global packaging and label industry and in-depth market data from AWA’s ongoing research.